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논문 검색결과
Type Year Title Cited Download
Journal
2008 3D SiP(System-in-Package) 기술 동향   최광성   주간기술동향, v.1367, pp.14-27 원문
Conference
2010 3D SiP Module using TSV and Novel Solder Bump Maker   Hyun-Cheol Bae   Electronic Components and Technology Conference (ECTC) 2010, pp.1637-1641 5
Conference
2012 3D SiP Module Using TSV and Novel Low-Volume Solder-on-Pad(SoP) Process   Hyun-Cheol Bae   Electronic System-Integration Technology Conference (ESTC) 2012, pp.1-4 1
Conference
2019 3D Reconstruction of Leg Bones from X-Ray Images using CNN-based Feature Analysis   Hangkee Kim   International Conference on Information and Communication Technology Convergence (ICTC) 2019, pp.669-672 24
Conference
2015 3D RF 모듈용 고 저항 실리콘 인터포저 기술 개발   최광성   한국마이크로전자 및 패키징학회 학술 대회 (춘계) 2015, pp.9-9
Conference
2017 3D Printing of Porous Calcium Phosphate Ceramics for Dental Applications   Soyoung Yang   한국세라믹학회 학술 대회 (춘계) 2017, pp.1-1
Journal
2017 3D Printing Based Single-Build Process for Electronic Devices   Hyun Woo Dang   Journal of Nanoscience and Nanotechnology, v.17, no.10, pp.7259-7263 0
Conference
2020 3D Portable Mapping System to Build Radio Fingerprints and Spatial Map   Yu-Cheol Lee   International Conference on Information and Communication Technology Convergence (ICTC) 2020, pp.1641-1643 3
Conference
2016 3D Object Registration for Image Guided Laparoscopic Surgery   Jae-Il Cho   Annual Conference on Engineering and Applied Science (ACEAT) 2016, pp.635-642
Conference
2023 3D Object Classification and Segmentation from Large Scale Area Reconstruction   Hye Sun Kim   International Conference on Information and Communication Technology Convergence (ICTC) 2023, pp.1-3 0