Subjects : Mechanical properties (PMCs)

Articles (31)
Patents (0)
R&D Reports (0)

논문 검색결과
Type	Year	Title	Cited
Journal	2025	Thermoforming 2D films into 3D electronics for high-performance, customizable tactile sensing Choi Jungrak SCIENCE ADVANCES, v.11, no.20, pp.1-12	0
Journal	2025	Thermoforming 2D films into 3D electronics for high-performance, customizable tactile sensing 이돈호 SCIENCE ADVANCES, v.11, no.20, pp.1-12	0
Journal	2025	Thermoforming 2D films into 3D electronics for high-performance, customizable tactile sensing 한찬규 SCIENCE ADVANCES, v.11, no.20, pp.1-12	0
Journal	2025	Broad-Range Supersensitive and Transparent Patterned HydrogelBased Pressure Sensor with Long-Term Stability 강병수 ACS APPLIED POLYMER MATERIALS, v.7, no.2, pp.1-8	1
Conference	2024	A Turbidity Inspection Method to Enhance the Efficiency of the Post-Processing Cleaning Process in Additive Manufacturing Environments Kang Hyun Chul International Conference on Information and Communication Technology Convergence (ICTC) 2024, pp.1391-1392	0
Conference	2024	Development of a Post-Processing Automation System to Increase the Efficiency of the Additive Manufacturing Process Kim Min Gi International Conference on Information and Communication Technology Convergence (ICTC) 2024, pp.1327-1328	0
Journal	2024	Thermo-mechanical properties of shape-recoverable structural composites via vacuum-assisted resin transfer molding process and in-situ polymerization of poly (tert-butyl acrylate-co-acrylic acid) copolymer 전재경 Composites Part A: Applied Science and Manufacturing, v.185, pp.1-11	2
Journal	2023	Mechanically Robust Ultrathin Solid Electrolyte Membranes Using a Porous Net Template for All-Solid-State Batteries Seok Hun Kang ACS Applied Materials & Interfaces, v.15, no.23, pp.28064-28072	11
Journal	2023	Thermally stable and soft pressure-sensitive adhesive for foldable electronics 정기훈 Chemical Engineering Journal, v.452, no.1, pp.1-8	21
Journal	2023	Thermally stable and soft pressure-sensitive adhesive for foldable electronics 조우성 Chemical Engineering Journal, v.452, no.1, pp.1-8	21
Conference	2021	Thermal and Electrical Reliability Analysis of TO-247 for Bonding Method, Substrate Structure and Heat Dissipation Bonding Material Donghwan Kim Electronic Components and Technology Conference (ECTC) 2021, pp.1950-1956	5
Journal	2020	Dielectric Elastomers UV-Cured from Poly(dimethylsiloxane) Solution in Vinyl Acetate Park Seung Koo Polymers, v.12, no.11, pp.1-8	5
Conference	2018	Thermal Analysis of SiC Power Semiconductor with Copper Clip Bonding and Copper Sintering Paste Inhoo Kim International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) 2018, pp.1-4
Journal	2018	Crosslinkable deoxidizing hybrid adhesive of epoxy–diacid for electrical interconnections in semiconductor packaging Keonsoo Jang Polymer International, v.67, no.9, pp.1241-1247	21
Journal	2018	Mechanics and Rheology of Basalt Fiber-Reinforced Polycarbonate Composites Keonsoo Jang Polymer, v.147, pp.133-141	57
Conference	2017	Silica Filler Content in NCP and its Effects on the Reliability of 3D TSV Multi-Stack under Thermal Shock Test 주니어 Electronics Packaging Technology Conference (EPTC) 2017, pp.1-8	7
Conference	2017	Cylindric 3D Force Sensor Using a Flexible MCNTs/PDMS Composite Material 문상준 International Conference on Information and Communication Technology Convergence (ICTC) 2017, pp.758-760	0
Journal	2017	Efficient Large-Area Transparent OLEDs Based on a Laminated Top Electrode with an Embedded Auxiliary Mesh Jong Tae Lim ACS Photonics, v.4, no.5, pp.1114-1122	49
Journal	2017	Efficient Large-Area Transparent OLEDs Based on a Laminated Top Electrode with an Embedded Auxiliary Mesh 진원용 ACS Photonics, v.4, no.5, pp.1114-1122	49
Journal	2017	Efficient Large-Area Transparent OLEDs Based on a Laminated Top Electrode with an Embedded Auxiliary Mesh 박성희 ACS Photonics, v.4, no.5, pp.1114-1122	49
Journal	2016	Compressive Strength and Biomineralisation Improvement by Water Glass Coating on Porous Calcium Phosphate Scaffolds Indu Bajpai Advances in Applied Ceramics, v.115, no.4, pp.243-248	5
Journal	2015	Reduced Water Vapor Transmission Rate of Graphene Gas Barrier Films for Flexible Organic Field-Effect Transistors Sooji Nam ACS Nano, v.9, no.6, pp.5818-5824	107
Journal	2015	Reduced Water Vapor Transmission Rate of Graphene Gas Barrier Films for Flexible Organic Field-Effect Transistors 이영빈 ACS Nano, v.9, no.6, pp.5818-5824	107
Journal	2015	Reduced Water Vapor Transmission Rate of Graphene Gas Barrier Films for Flexible Organic Field-Effect Transistors 최경준 ACS Nano, v.9, no.6, pp.5818-5824	107
Conference	2014	Structural Dependence of Thermal and Mechanical Properties of Ge-Sb-Se Chalcogenide Glass for Use in Molded Lens Applications International Symposium on Non-Oxide and New Optical Glasses (ISNOG) 2014, pp.1-1
Conference	2012	Improvement of Mechanical Properties in Replica Mold Using Thermal Initiator Jeong Ye Sul International Conference on Molecular Electronics and Devices (ME&D) 2012, pp.1-1
Journal	2012	Fabrication of Low-Cost Submicron Patterned Polymeric Replica Mold with High Elastic Modulus over a Large Area Kim Joo Yeon Soft Matter, v.8, no.4, pp.1184-1189	20
Journal	2011	Amorphous In-Sn-Zn-O Films Deposited on Polymer and Glass Substrates Using Co-Sputtering System 방준호 Journal of Nanoelectronics and Optoelectronics, v.6, no.3, pp.369-374	0
Journal	2010	Hydrogen Defect Passivation of Silicon Transistor on Plastic for High Performance Flexible Device Application Musarrat Hasan Electrochemical and Solid-State Letters, v.13, no.3, pp.H80-H82	2
Journal	2008	Investigation of the Effect of Calcination Temperature on HMDS-treated Ordered Mesoporous Silica Film 하태정 Journal of Colloid and Interface Science, v.326, no.1, pp.186-190	13
Journal	2008	HMDS Treatment of Ordered Mesoporous Silica Film for Low Dielectric Application 하태정 한국세라믹학회지, v.45, no.1, pp.48-53	1

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