공정 기술, HDP, HTO, SiON, CMP, DMOS, WL-IPD, High Temperature Oxide, Oxynitride, Chemical Mechanical Polishing, Wafer-level Integrated Passive Device
Funding Org.
한국전자통신연구원
Research Org.
한국전자통신연구원
Project Code
09ZB1400, Development support for customer-based convergence components,
Hee-Bum Jung
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