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Journal
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2022 |
Temperature monitoring techniques of power cable joints in underground utility tunnels using a fiber Bragg grating
Hyunjin Kim ICT Express, v.8, no.4, pp.626-632 |
14 |
원문
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Conference
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2022 |
Event Driven Communication of BLE composite Sensors for Monitoring Temperature of Hot Press Forming
Nam Hong Soon International Conference on Consumer Electronics (ICCE) 2022 : Asia, pp.69-70 |
0 |
원문
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Conference
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2021 |
Temperature Sensor Circuit with Dynamic Element Matching in CMOS 65 nm for a mmWave Beamformer
Jang Seunghyun International Conference on Information and Communication Technology Convergence (ICTC) 2021, pp.1390-1392 |
2 |
원문
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Journal
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2021 |
Gamma‐Ray Tolerant Flexible Pressure–Temperature Sensor for Nuclear Radiation Environment
Shuvra Mondal Advanced Materials Technologies, v.6, no.4, pp.1-9 |
22 |
원문
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Journal
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2021 |
A Sensing Device with the Optical Temperature Sensors-Based Quad-RX Module and a Security Module
Kyeeun Kim Sensors, v.21, no.5, pp.1-11 |
2 |
원문
|
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Conference
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2018 |
A Tesbed for Experimenting IoT Platform on High-Voltage Customer Electrical Installation
Kang Hyunjoo International Conference on Information and Communication Technology Convergence (ICTC) 2018, pp.1301-1304 |
7 |
원문
|
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Conference
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2015 |
Crowd-sourcing Home Energy Efficiency Measurement System
Son Young Sung International Conference on Information and Communication Technology Convergence (ICTC) 2015, pp.1275-1278 |
0 |
원문
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Journal
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2013 |
Seebeck Coefficient Characterization of Highly Doped n- and p-Type Silicon Nanowires for Thermoelectric Device Applications Fabricated with Top-Down Approach
Kim Jae Hyeon Journal of Nanoscience and Nanotechnology, v.13, no.9, pp.6416-6419 |
12 |
원문
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Journal
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2012 |
Evaluation of Seebeck coefficients in n- and p-type silicon nanowires fabricated by complementary metal–oxide–semiconductor technology
Hyun Younghoon Nanotechnology, v.23, no.40, pp.1-7 |
13 |
원문
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Journal
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2012 |
Top-Down Processed Silicon Nanowires for Thermoelectric Applications
Jang Moon Gyu Journal of Nanoscience and Nanotechnology, v.12, no.4, pp.3552-3554 |
7 |
원문
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Conference
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2011 |
Temperature Distribution Analysis of Silicon Nanowire for Thermoelectric Applications
Hyun Younghoon Nanotechnology Materials and Devices Conference (NMDC) 2011, pp.194-195 |
0 |
원문
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Journal
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2010 |
Voltage-induced Current-Jump Assisted by Infrared or Temperature in p-Type GaAs
Choi Sungyoul Journal of the Korean Physical Society, v.57, no.61, pp.1769-1772 |
0 |
원문
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Journal
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2010 |
Linear Characteristics of a Metal-Insulator Transition Voltage and Oscillation Frequency in VO2 Devices
Kim Bongjun IEEE Electron Device Letters, v.31, no.11, pp.1314-1316 |
11 |
원문
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Journal
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2009 |
Control of Current-Jump Induced by Voltage, Temperature, Light in P-Type GaAs: Programmable Critical Temperature Sensor
Choi Sungyoul Applied Physics Letters, v.95, no.23, pp.1-4 |
4 |
원문
|
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Conference
|
2009 |
A Resistance Deviation-to-Time Interval Converter for Resistive Sensors
Park Ji Man International SOC Conference (SOCC) 2008, pp.101-104 |
7 |
원문
|
|
Journal
|
2008 |
Fabrication of an Integrated Microfluidic Device Based on a Heat-sensitive Poly(N-isopropylacrylamide) Polymer and Micromachining Protocols for Programmed Bio-molecular Patterning
Dae-Sik Lee Sensors and Actuators B : Chemical, v.130, no.1, pp.150-157 |
18 |
원문
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Journal
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2007 |
A Temperature-Controllable Microelectrode and Its Application to Protein Immobilization
Dae-Sik Lee ETRI Journal, v.29, no.5, pp.667-669 |
9 |
원문
|
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Conference
|
2007 |
Programmable VO2 Temperature Sensor Controlled by a Constant Voltage
Kim Bongjun International Conference on Solid State Devices and Materials (SSDM) 2007, pp.612-613 |
|
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Journal
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2006 |
Temperature dependence of the first-order metal-insulator transition in VO2 and programmable critical temperature sensor
Kim Bong Jun Applied Physics Letters, v.90, no.2, pp.1-4 |
227 |
원문
|
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Conference
|
2006 |
Plastic-Silicon PCR Amplification System Made Using Microfabrication Technologies
Dae-Sik Lee IEEE Sensors 2006, pp.592-595 |
1 |
원문
|
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Conference
|
2004 |
Plastic thermally controllable platform with integrated thin film microcomponents
Dae-Sik Lee Micro- and Nanotechnology: Materials, Processes, Packaging, and Systems II (SPIE 5650), pp.429-437 |
0 |
원문
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