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Conference
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2025 |
Enhancing Reliability of 30μm-Pitch Interconnections by Optimizing Material Properties of Laser NonConductive Paste (LNCP) for Room Temperature Laser-Assisted Bonding with Compression (LABC)
Lee Gaeun Electronic Components and Technology Conference, pp.1-7 |
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Conference
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2024 |
Laser Assisted Bonding (LAB) technology using Laser Non-Conductive Paste (NCP) for Micro solder bumps
Jang Ki Seok International Symposium on Microelectronics and Packaging (ISMP) 2024, pp.272-272 |
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Conference
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2024 |
Enhancing Reliability of 30μm-Pitch Interconnections Using Room Temperature Laser-Assisted Bonding with Compression (LABC) with Laser Non-Conductive Paste (LNCP)
Lee Gaeun International Symposium on Microelectronics and Packaging (ISMP) 2024, pp.1-14 |
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Conference
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2024 |
Laser Assisted Bonding (LAB) based Flip-chip process for fine pitch solder bumps device using Laser Non-Conductive Paste (NCP)
Jang Ki Seok Electronic System-Integration Technology Conference (ESTC) 2024, pp.1-4 |
0 |
원문
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Conference
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2024 |
Chip-on-Wafer (CoW) Technology Utilizing LaserAssisted Bonding with Compression (LABC) for Bump Counts Exceeding 500,000 at a 20m Pitch
Choi Kwang-Seong Electronic Components and Technology Conference (ECTC) 2024, pp.943-948 |
0 |
원문
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Conference
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2023 |
Anisotropic Solder Paste (ASP) Material Solution for Laser Assisted Bonding (LAB) Process
Jang Ki Seok European Microelectronics and Packaging Conference (EMPC) 2023, pp.1-4 |
0 |
원문
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Conference
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2023 |
Process Window of Mini-LED Display Panel Packaging using Laser Assisted Bonding Technology
Eom Yong Sung European Microelectronics and Packaging Conference (EMPC) 2023, pp.1-4 |
0 |
원문
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Conference
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2023 |
Laser-Assisted Bonding with Compression (LABC) based Tiling Bonding Technology, Enabling Technology for Chiplet Integration
Choi Kwang-Seong Electronic Components and Technology Conference (ECTC) 2023, pp.1385-1389 |
4 |
원문
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Journal
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2023 |
Machine Learning‐Based Solution for Thermomechanical Analysis of MMIC Packaging
강수민 ADVANCED MATERIALS TECHNOLOGIES, v.8, no.5, pp.1-8 |
3 |
원문
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Conference
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2022 |
Epoxy based Solder Paste for Flexible Substrate with Laser Assisted Bonding Process
Jang Ki Seok Electronic System-Integration Technology Conference (ESTC) 2022, pp.28-30 |
2 |
원문
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Conference
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2022 |
Laser-Assisted Bonding (LAB) Process and its Bonding Materials as Technologies enabling the Low-Carbon Era
Choi Kwang-Seong Electronic Components and Technology Conference (ECTC) 2022, pp.196-203 |
5 |
원문
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Conference
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2021 |
Simultaneous Transfer and Bonding (SITRAB) Process for Micro-LEDs Using Laser-Assisted Bonding with Compression (LABC) Process and SITRAB Adhesive
Choi Kwang-Seong Electronic Components and Technology Conference (ECTC) 2021, pp.1607-1613 |
14 |
원문
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Conference
|
2021 |
Development of simultaneous transferring and bonding (SITRAB) process for µLED arrays using Anisotropic Solder Paste (ASP) and Laser-Assisted Bonding (LAB) Technology
Jiho Joo Electronic Components and Technology Conference (ECTC) 2021, pp.687-692 |
5 |
원문
|
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Conference
|
2021 |
59‐5: Simultaneous Transfer and Bonding (SITRAB) Process for Mini‐LED Display
Choi Kwang-Seong Society for Information Display (SID) International Symposium 2021, pp.841-844 |
5 |
원문
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Conference
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2020 |
Development of film-based ultra-compact GaAs photovoltaic module using Laser-Assisted Bonding
Jiho Joo European Photovoltaic Solar Energy Conference and Exhibition (EU PVSEC) 2020, pp.1-1 |
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Journal
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2020 |
Epoxy-based Interconnection Materials and Process Technology Trends for Semiconductor Packaging
Eom Yong Sung 전자통신동향분석, v.35, no.4, pp.1-10 |
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원문
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Conference
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2020 |
Development of Digital Signage Modules composed of Mini-LEDs using Laser-Assisted Bonding (LAB) Technology
Choi Kwang-Seong Electronic Components and Technology Conference (ECTC) 2020, pp.1031-1036 |
9 |
원문
|
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Conference
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2020 |
Development of bonding process for flexible devices with fine-pitch interconnection using Anisotropic Solder Paste and Laser-Assisted Bonding Technology
Jiho Joo Electronic Components and Technology Conference (ECTC) 2020, pp.1309-1314 |
11 |
원문
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Conference
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2019 |
Development of Laser-Assisted Bonding with Compression (LABC) Process for 3D IC Integration
Choi Kwang-Seong International 3D Systems Integration Conference (3DIC) 2019, pp.1-3 |
3 |
원문
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Conference
|
2019 |
Advanced Interconnection technology with Laser Assisted Bonding Process for PET Substrate
Eom Yong Sung European Microelectronics and Packaging Conference (EMPC) 2019, pp.1-5 |
0 |
원문
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Conference
|
2019 |
Enhanced Performance of Laser-Assisted Bonding with Compression (LABC) Compared with Thermal Compression Bonding (TCB) Technology
Choi Kwang-Seong Electronic Components and Technology Conference (ECTC) 2019, pp.197-203 |
20 |
원문
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Journal
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2018 |
Laser-Assisted Bonding Technology for Interconnections of Multidimensional Heterogeneous Devices
Choi Kwang-Seong 전자통신동향분석, v.33, no.6, pp.50-57 |
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원문
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Journal
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2012 |
Laser-Assisted Control of Electrical Oscillation in VO2 Thin Films Grown by Pulsed Laser Deposition
Kim Bongjun Japanese Journal of Applied Physics, v.51, no.10, pp.1-5 |
9 |
원문
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Journal
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2012 |
Photo-Assisted Electrical Oscillation in Two-Terminal Device Based on Vanadium Dioxide Thin Film
Seo Giwan IEEE/OSA Journal of Lightwave Technology, v.30, no.16, pp.2718-2724 |
14 |
원문
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Conference
|
2007 |
Laser-Assisted Electrical Gating in a Two-Terminal Device Based on Vanadium Dioxide Thin Film
Lee Yong Wook Conference on Lasers and Electro-Optics (CLEO) 2007, pp.1-2 |
0 |
원문
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