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Conference
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2024 |
Hybrid Integrated Photonic circuits for High Bandwidth Coherent Receivers in Optical Communication Networks
Jong-Hoi Kim International Conference on Information and Communication Technology Convergence (ICTC) 2024, pp.1432-1433 |
0 |
원문
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Journal
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2021 |
Compact Hybrid-Integrated 4 × 80-Gbps TROSA Module Using Optical Butt-Coupling of DML/SI-PD and Silica AWG Chips
Yun Seok Jun IEEE/OSA Journal of Lightwave Technology, v.39, no.8, pp.2468-2475 |
5 |
원문
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Conference
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2020 |
A Hybrid-Integrated 400G TROSA Module Using Chip-to-Chip Optical Butt-Coupling
Han Young-Tak Optical Fiber Communication Conference (OFC) 2020, pp.1-3 |
5 |
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Journal
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2020 |
Optical Subassembly Modules Using Light Sources Butt-Coupled With Silica-Based PLC
Yun Seok Jun IEEE Photonics Technology Letters, v.32, no.2, pp.132-135 |
2 |
원문
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Journal
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2018 |
Cost-effective 400-Gbps Micro-intradyne Coherent Receiver using Optical Butt-coupling and FPCB Wirings
Lee Seo Young Optics Express, v.26, no.22, pp.28453-28460 |
2 |
원문
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Conference
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2018 |
칩투칩본딩 및 FPCB 배선을 이용한 저가형 400Gbps 마이크로 인드라다인 코히어런트 수신기
Han Young-Tak Opto-Electronics and Communications Conference (OECC) 2018, pp.1-2 |
0 |
원문
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Journal
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2016 |
Cost Effective Silica-Based 100 G DP-QPSK Coherent Receiver
Lee Seo Young ETRI Journal, v.38, no.5, pp.981-987 |
7 |
원문
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Conference
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2015 |
A Novel Packaging Method of Fully Passive Optical Alignment for Multi-Chennel Optical Interconnection Module
Lim Kwon-Seob Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) 2015, pp.156-158 |
0 |
원문
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Conference
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2012 |
Hybrid-Integrated Coherent Receiver Using Chip-to-Chip Bonding Technology
Jong-Hoi Kim Asia Communications and Photonics Conference (ACP) 2012, pp.1-4 |
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Conference
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2011 |
Chip-to-chip Bonding용 Fluxing Underfill 개발
Jeon Su Jeong 한국마이크로전자 및 패키징학회 학술 대회 (추계) 2011, pp.1-1 |
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Conference
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2011 |
Bumping and Stacking Processes for 3D IC using Fluxfree Polymer
Choi Kwang-Seong Electronic Components and Technology Conference (ECTC) 2011, pp.1746-1751 |
3 |
원문
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Journal
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2010 |
Optical Chip-to-Chip Link System by Using Optical Wiring Method for Reducing EMI
Cho In Kui IEEE Transactions on Advanced Packaging, v.33, no.3, pp.722-728 |
4 |
원문
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Journal
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2009 |
Silver Stripe Optical Waveguide for Chip-to-Chip Optical Interconnections
Jin Tae Kim IEEE Photonics Technology Letters, v.21, no.13, pp.902-904 |
15 |
원문
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Conference
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2008 |
Chip-To-Chip Optical Link By Using Optical Wiring Method
Cho In Kui Photonics: Design, Technology, and Packaging III (SPIE 6801), v.6801, pp.1-8 |
0 |
원문
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Journal
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2008 |
Chip-to-chip Optical Interconnect using Gold Long-range Surface Plasmon Polariton Waveguides
Jin Tae Kim Optics Express, v.16, no.17, pp.13133-13138 |
108 |
원문
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Journal
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2008 |
Optical Interconnection Platform Composed of Fiber-Embedded Board, 90˚-Bent Fiber Block, and 10-Gb/s Optical Module
황성환 IEEE/OSA Journal of Lightwave Technology, v.26, no.11, pp.1479-1485 |
9 |
원문
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Journal
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2008 |
Nonuniform Output Characteristics of Laser Diode with Wet-etched Spot-size Converter
Choe Joong-Seon Optics Express, v.16, no.8, pp.5790-5796 |
2 |
원문
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Journal
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2007 |
Chip-to-Chip Optical Link System Using an Optical Wiring Method
Cho In Kui IEEE Photonics Technology Letters, v.19, no.15, pp.1151-1153 |
5 |
원문
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Journal
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2007 |
Two-Dimensional Optical Interconnection Based on Two-Layered Optical Printed Circuit Board
황선환 IEEE Photonics Technology Letters, v.19, no.6, pp.411-413 |
36 |
원문
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Journal
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2006 |
Multichip Optical Transmitter Module for Chip-to-chip Interconnection on Optical PCBs
Kang Sae-Kyoung Electronics Letters, v.42, no.14, pp.805-806 |
9 |
원문
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Journal
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2004 |
Polymer wavelength channel selector composed of electrooptic polymer switch array and two polymer arrayed waveguide gratings
Ahn Joon Tae IEEE Photonics Technology Letters, v.16, no.6, pp.1567-1569 |
24 |
원문
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