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Journal
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2022 |
Switching and Heat-Dissipation Performance Analysis of an LTCC-Based Leadless Surface Mount Package
Jung Dong Yun Journal of Semiconductor Technology and Science, v.22, no.1, pp.1-9 |
1 |
원문
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Conference
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2021 |
Recent progress of Diamond heat spreader for next generation GaN power semiconductor
Hyung Seok Lee 한국LED·광전자학회 학술대회 2021, pp.1-1 |
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Conference
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2021 |
Switching and Heat-dissipation Performance Analysis of an LTCC-based Leadless Surface Mount Package Using a Power Factor Correction Converter
Jung Dong Yun International Conference on Electronics, Information and Communication (ICEIC) 2021, pp.811-813 |
2 |
원문
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Conference
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2020 |
Multi-layer Ceramic based Surface Mount Device Packaging for 1200 V and 1700 V SiC SBD Power Semiconductors
Jung Dong Yun International Conference on Consumer Electronics (ICCE) 2020 : Asia, pp.603-606 |
4 |
원문
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Conference
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2019 |
Switching Performances by Chip Interconnections in Power Semiconductor Discrete Packages
Jung Dong Yun International Symposium on Microelectronics and Packaging / Electronic Materials and Packaging(EMAP) Conference (ISMP-EMAP) 2019, pp.136-137 |
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Conference
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2018 |
Thermal Analysis of SiC Power Semiconductor with Copper Clip Bonding and Copper Sintering Paste
Inhoo Kim International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) 2018, pp.1-4 |
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Journal
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2017 |
Power Semiconductor SMD Package Embedded in Multilayered Ceramic for Low Switching Loss
Jung Dong Yun ETRI Journal, v.39, no.6, pp.866-873 |
12 |
원문
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Conference
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2016 |
Global R&D Trend of High Efficiency and Low Loss GaN Power Semiconductor Technology
Mun Jae Kyoung 대한전자공학회 학술 대회 (추계) 2016, pp.939-942 |
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Conference
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2016 |
Multi-layer Substrate Based Power Semiconductor Package for Low Parasitic Inductance and High Heat Transfer
Jung Dong Yun Asia-Pacific Workshop on Fundamentals and Applications of Advanced Semiconductor Devices (AWAD) 2016, pp.283-285 |
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Conference
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2016 |
Design and Analysis of a Boost Converter to Verify Power Semiconductor
Hyun-Gyu Jang Asia-Pacific Workshop on Fundamentals and Applications of Advanced Semiconductor Devices (AWAD) 2016, pp.286-287 |
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Conference
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2015 |
Effects on Breakdown Voltage Characteristics of Various Field Plates in GaN FETs
Woojin Chang International Conference on Nitride Semiconductors (ICNS) 2015, pp.1-2 |
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Journal
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2014 |
Thermal Analysis and Testing of a Heat Pipe With Woven Wired Wick
Moon Seok-Hwan IEEE Transactions on Components, Packaging, and Manufacturing Technology, v.4, no.6, pp.991-998 |
6 |
원문
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Journal
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2009 |
전력반도체 시장 전망 및 국내외 개발 동향
Hwangsoo Chun 주간기술동향, v.1399, pp.1-13 |
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