Subject

Subjects : Via-hole

  • Articles (15)
  • Patents (6)
  • R&D Reports (0)
논문 검색결과
Type Year Title Cited Download
Conference 2018 Fabrication and Characteristics of GaN HEMT on SiC Device with Internal Backside Via-hole in Active Region for MMIC Applications   Min Byoung-Gue  한국 반도체 학술 대회 (KCS) 2018, pp.663-663
Conference 2016 Backside Process of AlGaN/GaN HEMT on SiC with Optimized Via-Hole Etching Conditions   Min Byoung-Gue  International Symposium on the Physics of Semiconductors and Applications (ISPSA) 2016, pp.1-1
Journal 2015 Fabrication and Electrical Properties of an AlGaN/GaN HEMT on SiC with a Taper-Shaped Backside Via Hole   Min Byoung-Gue  Journal of the Korean Physical Society, v.67, no.4, pp.718-722 2 원문
Conference 2014 Fabrication of GaN HEMT on SiC with Taper-Shaped Backside Via-Hole   Min Byoung-Gue  International Symposium Physics of Semiconductors and Applications (ISPSA) 2014, pp.80-80
Journal 2013 Preliminary Works of Contact via Formation of LCD Backplanes Using Silver Printing   Yong Suk Yang  ETRI Journal, v.35, no.4, pp.571-577 7 원문
Journal 2013 Slot‐array antenna for UHF RFID shelf applications   Choi Won Kyu  Microwave and Optical Technology Letters, v.55, no.7, pp.1511-1515 4 원문
Conference 2013 Development of the Backside Via Holes Process for SiC Power Device   Sang Choon Ko  한국 반도체 학술 대회 (KCS) 2013, pp.1-2
Conference 2011 A Cascaded Quadruplet (CQ) Bandpass Filter Using a Mushroom Resonator with an Asymmetrically Positioned Via-hole   Baik Jung Woo  International Symposium on Antennas and Propagation (ISAP) 2011, pp.1-4
Conference 2011 U-shaped slot-array antenna for RFID shelf in the UHF   Choi Won Kyu  Antennas and Propagation Society International Symposium (APSURSI) 2011, pp.1449-1451 2 원문
Journal 2010 Characteristics of Via-Hole Interconnections Fabricated by Using an Inkjet Printing Method   Yong Suk Yang  Journal of the Korean Physical Society, v.57, no.61, pp.1699-1701 5 원문
Conference 2009 Fabrication and Characteristics of Via-Hole Interconnections by an Inkjet Printing Method   Yong Suk Yang  International Conference on Advanced Materials and Devices (ICAMD) 2009, pp.1-1
Journal 2009 Charge Transfer and Trapping Properties in Polymer Gate Dielectrics for Non-Volatile Organic Field-Effect Transistor Memory Applications   백강준  Solid-State Electronics, v.53, no.11, pp.1165-1168 23 원문
Journal 2008 Structure Effects on Resistive Switching of Al/TiOx/Al Devices for RRAM Applications   유리은  IEEE Electron Device Letters, v.29, no.4, pp.331-333 100 원문
Journal 2006 Charge Transport of Alkanethiol Self-Assembled Monolayers in Micro-Via Hole Devices   김태욱  Journal of Nanoscience and Nanotechnology, v.6, no.11, pp.3487-3490 5
Journal 2005 Electronic Transport through Aromatic Thiol Monolayer Assembled in the Nano Via-Hole Electrode   이창진  Japanese Journal of Applied Physics, v.44, no.1B, pp.530-534 3 원문
특허 검색결과
Status Year Patent Name Country Family Pat. KIPRIS
Registered 2008 Switching circuit for millimeter waveband control circuit UNITED STATES
Registered 2013 SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME UNITED STATES
Registered 2011 METHOD OF MANUFACTURING VIA ELECTRODE UNITED STATES
Registered 2020 세라믹 적층형 반도체 패키지 및 패키징 방법 KOREA KIPRIS
Registered 2012 SEMICONDUCTOR APPARATUS AND MANUFACTURING METHOD THEREOF UNITED STATES
Registered 2015 SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME UNITED STATES
연구보고서 검색결과
Type Year Research Project Primary Investigator Download
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