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Conference
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2024 |
Laser Assisted Bonding (LAB) based Flip-chip process for fine pitch solder bumps device using Laser Non-Conductive Paste (NCP)
Jang Ki Seok Electronic System-Integration Technology Conference (ESTC) 2024, pp.1-4 |
0 |
원문
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Conference
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2024 |
Chip-on-Wafer (CoW) Technology Utilizing LaserAssisted Bonding with Compression (LABC) for Bump Counts Exceeding 500,000 at a 20m Pitch
Choi Kwang-Seong Electronic Components and Technology Conference (ECTC) 2024, pp.943-948 |
0 |
원문
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Conference
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2023 |
Anisotropic Solder Paste (ASP) Material Solution for Laser Assisted Bonding (LAB) Process
Jang Ki Seok European Microelectronics and Packaging Conference (EMPC) 2023, pp.1-4 |
0 |
원문
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Conference
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2023 |
Process Window of Mini-LED Display Panel Packaging using Laser Assisted Bonding Technology
Eom Yong Sung European Microelectronics and Packaging Conference (EMPC) 2023, pp.1-4 |
0 |
원문
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Conference
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2023 |
Design and Verification Methodologies of D-Band Antenna Modules for Security Imaging Applications
Lee Jaeyeong International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting 2023, pp.329-330 |
2 |
원문
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Conference
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2023 |
Laser-Assisted Bonding with Compression (LABC) based Tiling Bonding Technology, Enabling Technology for Chiplet Integration
Choi Kwang-Seong Electronic Components and Technology Conference (ECTC) 2023, pp.1385-1389 |
4 |
원문
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Conference
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2023 |
2.5D Large-Scale Interposer Bonding Process Verification using Daisy-Chain for PIM Heterogeneous Integration Platform
Sujin Park International Conference on Electronics, Information and Communication (ICEIC) 2023, pp.1-3 |
0 |
원문
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Conference
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2022 |
Low Height Wire bond Looping Technology Using Wedge Bonding for the MMIC Package
박아영 Electronic System-Integration Technology Conference (ESTC) 2022, pp.169-174 |
0 |
원문
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Conference
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2022 |
Epoxy based Solder Paste for Flexible Substrate with Laser Assisted Bonding Process
Jang Ki Seok Electronic System-Integration Technology Conference (ESTC) 2022, pp.28-30 |
2 |
원문
|
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Conference
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2021 |
Simultaneous Transfer and Bonding (SITRAB) Process for Micro-LEDs Using Laser-Assisted Bonding with Compression (LABC) Process and SITRAB Adhesive
Choi Kwang-Seong Electronic Components and Technology Conference (ECTC) 2021, pp.1607-1613 |
14 |
원문
|
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Conference
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2021 |
59‐5: Simultaneous Transfer and Bonding (SITRAB) Process for Mini‐LED Display
Choi Kwang-Seong Society for Information Display (SID) International Symposium 2021, pp.841-844 |
5 |
원문
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Journal
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2020 |
Epoxy-based Interconnection Materials and Process Technology Trends for Semiconductor Packaging
Eom Yong Sung 전자통신동향분석, v.35, no.4, pp.1-10 |
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원문
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Conference
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2020 |
Development of bonding process for flexible devices with fine-pitch interconnection using Anisotropic Solder Paste and Laser-Assisted Bonding Technology
Jiho Joo Electronic Components and Technology Conference (ECTC) 2020, pp.1309-1314 |
11 |
원문
|
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Conference
|
2019 |
Development of Laser-Assisted Bonding with Compression (LABC) Process for 3D IC Integration
Choi Kwang-Seong International 3D Systems Integration Conference (3DIC) 2019, pp.1-3 |
3 |
원문
|
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Conference
|
2019 |
Advanced Interconnection technology with Laser Assisted Bonding Process for PET Substrate
Eom Yong Sung European Microelectronics and Packaging Conference (EMPC) 2019, pp.1-5 |
0 |
원문
|
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Conference
|
2019 |
Enhanced Performance of Laser-Assisted Bonding with Compression (LABC) Compared with Thermal Compression Bonding (TCB) Technology
Choi Kwang-Seong Electronic Components and Technology Conference (ECTC) 2019, pp.197-203 |
20 |
원문
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Journal
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2016 |
Sn58Bi Solder Interconnection for Low-Temperature Flex-on-Flex Bonding
Haksun Lee ETRI Journal, v.38, no.6, pp.1163-1171 |
14 |
원문
|
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Conference
|
2015 |
Characterization of 3D Stacked High Resistivity Si Interposers with Polymer TSV Liners for 3D RF Module
Choi Kwang-Seong Electronic Components and Technology Conference (ECTC) 2015, pp.928-933 |
4 |
원문
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|
Journal
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2015 |
Interconnection Technology Based on InSn Solder for Flexible Display Applications
Choi Kwang-Seong ETRI Journal, v.37, no.2, pp.387-394 |
13 |
원문
|
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Conference
|
2014 |
Flip-Chip Bonding Processes with Low Volume SoP Technology
Eom Yong Sung Electronic System-Integration Technology Conference (ESTC) 2014, pp.1-4 |
0 |
원문
|
|
Journal
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2014 |
Characterization of Fluxing and Hybrid Underfills with Micro-encapsulated Catalyst for Long Pot Life
Eom Yong Sung ETRI Journal, v.36, no.3, pp.343-351 |
35 |
원문
|
|
Conference
|
2014 |
Maskless Screen Printing Technology for 20μm-Pitch, 52InSn Solder Interconnections in Display Applications
Choi Kwang-Seong Electronic Components and Technology Conference (ECTC) 2014, pp.1154-1159 |
8 |
원문
|
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Journal
|
2013 |
Fine‐Pitch Solder on Pad Process for Microbump Interconnection
Bae Hyun-Cheol ETRI Journal, v.35, no.6, pp.1152-1155 |
22 |
원문
|
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Conference
|
2012 |
Fine-Pitch, Low-Volume SoP(Solder-on-Pad) Process
Ho-Eun Bae Electronics Packaging Technology Conference (EPTC) 2012, pp.723-727 |
2 |
원문
|
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Conference
|
2011 |
Bumping and Stacking Processes for 3D IC using Fluxfree Polymer
Choi Kwang-Seong Electronic Components and Technology Conference (ECTC) 2011, pp.1746-1751 |
3 |
원문
|
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Journal
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2008 |
Electrical and Mechanical Characterization of an Anisotropic Conductive Adhesive with a Low Melting Point Solder
Eom Yong Sung Microelectronic Engineering, v.85, no.11, pp.2202-2206 |
32 |
원문
|
|
Journal
|
2007 |
A Flip-Chip-Packaged InP HBT Transimpedance Amplifier for 40-Gb/s Optical Link Applications
Ju Chull Won Journal of the Korean Physical Society, v.50, no.3, pp.862-865 |
2 |
원문
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