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Conference
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2024 |
Heat dissipation evaluation of epoxy-boron nitride-based non-conductive films with high thermal conductivity for fine-pitch solder bump interconnection
Oh Jin Hyuk European Materials Research Society (E-MRS) Meeting 2024 (Fall), pp.1-1 |
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Journal
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2024 |
Effect of inductively coupled plasma etch on the interface barrier behavior of (001) β-Ga2O3 Schottky barrier diode
Lee Hun Ki JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, v.42, no.4, pp.1-10 |
2 |
원문
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Conference
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2023 |
Analysis of Heat Dissipation Characteristics of Power Modules with Different Top Metal and Bottom Metal Thicknesses of Insulated Metal Substrate
박성효 대한전자공학회 학술 대회 (하계) 2023, pp.116-119 |
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Conference
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2022 |
Heat Dissipation Design of High-Power Wide-Bandgap Power Module with Insulated Metal Substrate
Jeong Bongmin International Conference and Exhibition on High Temperature Electronics Network (HiTEN) 2022, pp.66-70 |
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Journal
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2021 |
Experimental and Theoretical Investigation of the Effect of Filler Material on the Performance of Flexible and Rigid Thermoelectric Generators
Aminu Yusuf ACS Applied Materials & Interfaces, v.13, no.51, pp.61275-61285 |
20 |
원문
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Journal
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2021 |
Substrate Effects on the Electrical Properties in GaN-Based High Electron Mobility Transistors
Sungjae Chang Crystals, v.11, no.11, pp.1-10 |
6 |
원문
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Journal
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2021 |
Thermal Behavior of an AlGaN/GaN-based Schottky Barrier Diode on Diamond and Silicon Substrates
Kim Zin-Sig Journal of Nanoscience and Nanotechnology, v.21, no.8, pp.4429-4435 |
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원문
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Conference
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2021 |
Thermal and Electrical Reliability Analysis of TO-247 for Bonding Method, Substrate Structure and Heat Dissipation Bonding Material
Donghwan Kim Electronic Components and Technology Conference (ECTC) 2021, pp.1950-1956 |
5 |
원문
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Conference
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2020 |
Thermal analysis of power module using high heat dissipation substrate and bonding material
Donghwan Kim 대한전자공학회 학술 대회 (하계) 2020, pp.151-154 |
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Conference
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2020 |
Development of bonding process for flexible devices with fine-pitch interconnection using Anisotropic Solder Paste and Laser-Assisted Bonding Technology
Jiho Joo Electronic Components and Technology Conference (ECTC) 2020, pp.1309-1314 |
11 |
원문
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Journal
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2019 |
Efficiency Improvement of a DC/DC Converter using LTCC Substrate
Jung Dong Yun ETRI Journal, v.41, no.6, pp.811-819 |
8 |
원문
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Journal
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2019 |
Conductive adhesive with transient liquid‐phase sintering technology for high‐power device applications
Eom Yong Sung ETRI Journal, v.41, no.6, pp.820-828 |
10 |
원문
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Journal
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2019 |
Thermal Properties of Schottky Barrier Diode on AlGaN/GaN Heterostructures on Chemical Vapor Deposition Diamond
Kim Zin-Sig Journal of Nanoscience and Nanotechnology, v.19, no.10, pp.6119-6122 |
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원문
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Conference
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2019 |
GaN Device Technology for High Voltage and RF Power Application
Hyung Seok Lee 한러 과학기술의 날 2019, pp.1-1 |
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Journal
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2018 |
Technical Trends of Semiconductors for Harsh Environments
Woojin Chang 전자통신동향분석, v.33, no.6, pp.12-23 |
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원문
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Conference
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2018 |
ZnO Nanowire-based Capacitive Humidity Sensor Integrated on a Polyimide Layer with a Micro-heater
Jaewoo Lee International Conference and Exhibition for Nanotechnology (NANOPIA) 2018, pp.1-1 |
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Journal
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2018 |
A novel approach to ambient energy (thermoelectric, piezoelectric and solar-TPS) harvesting: Realization of a single structured TPS-fusion energy device using MAPbI3
Venkatraju Jella Nano Energy, v.52, pp.11-21 |
39 |
원문
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Journal
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2018 |
Proposal of Novel Structure for Wide Wavelength Tuning in Distributed Bragg Reflector Laser Diode with Single Grating Mirror
Kwon Oh Kee Optics Express, v.26, no.22, pp.1-9 |
14 |
원문
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Conference
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2018 |
Thermal Properties of Schottky Barrier Diode on AlGaN/GaN Heterostructures on CVD Diamond
Kim Zin-Sig 대한전자공학회 학술 대회 (하계) 2018, pp.195-198 |
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Journal
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2017 |
Thermal Conductivity and Thermal Boundary Resistances of ALD Al2O3 Films on Si and Sapphire
Lee Seung Min International Journal of Thermophysics, v.38, no.12, pp.1-10 |
5 |
원문
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Journal
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2017 |
Power Semiconductor SMD Package Embedded in Multilayered Ceramic for Low Switching Loss
Jung Dong Yun ETRI Journal, v.39, no.6, pp.866-873 |
12 |
원문
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Journal
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2017 |
Reconfigurable Yagi-Uda Antenna based on a Silicon Reflector with a Solid-State Plasma
박장순 Scientific Reports, v.7, pp.1-8 |
11 |
원문
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Journal
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2017 |
Reconfigurable Yagi-Uda Antenna based on a Silicon Reflector with a Solid-State Plasma
Kim Cheol Ho Scientific Reports, v.7, pp.1-8 |
11 |
원문
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Journal
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2017 |
Reconfigurable Yagi-Uda Antenna based on a Silicon Reflector with a Solid-State Plasma
김다진 Scientific Reports, v.7, pp.1-8 |
11 |
원문
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Conference
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2015 |
Thermal Conductivity Measurement of Silicon/Silicide Laminated Structures by 3W Method
최원철 European Materials Research Society (E-MRS) Meeting 2015 (Spring), pp.1-1 |
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Conference
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2015 |
Thermal Conductivity of Thin Film Al2O3 Grown by Atomic Layer Deposition
Kim Junsoo European Materials Research Society (E-MRS) Meeting 2015 (Spring), pp.1-1 |
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Journal
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2014 |
Na Effect on Flexible Cu(In,Ga)Se2 Photovoltaic Cell Depending on Diffusion Barriers (SiOx, i-ZnO) on Stainless Steel
Lee Woo Jung Materials Chemistry and Physics, v.147, no.3, pp.783-787 |
13 |
원문
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Conference
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2014 |
Development of a Heat Pipe Heat Dissipation Method for CPV Application
Moon Seok-Hwan International Conference on Concentrator Photovoltaic Systems (CPV) 2014, pp.140-143 |
4 |
원문
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Journal
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2013 |
Effect of Silicide/Silicon Hetero-Junction Structure on Thermal Conductivity and Seebeck Coefficient
Choi Won Chul Journal of Nanoscience and Nanotechnology, v.13, no.12, pp.7801-7805 |
6 |
원문
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Conference
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2011 |
Temperature Distribution Analysis of Silicon Nanowire for Thermoelectric Applications
Hyun Younghoon Nanotechnology Materials and Devices Conference (NMDC) 2011, pp.194-195 |
0 |
원문
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Journal
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2009 |
Enhanced Memory Behavior in Phase-Change Nonvolatile-Memory Devices Using Multilayered Structure of Compositionally Modified Ge–Sb–Te Films
Yoon Sung Min Japanese Journal of Applied Physics, v.48, no.4, pp.1-6 |
2 |
원문
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Journal
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2008 |
Improvement of Uncooled Infrared Imaging Detector by using Mesoporous Silica as a Thermal Isolation Layer
최선규 Ceramics International, v.34, no.4, pp.833-836 |
21 |
원문
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Conference
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2007 |
Novel Process for the Electrodes of Microbolometer
Ryu Hojun International Conference on Sensor Technologies and Applications (SENSORCOMM) 2007, pp.10-13 |
1 |
원문
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Conference
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2006 |
Numerical Analysis and IR Scan Test for Thermal Resistance of GaAs MMIC in a Communications Satellite
Kwak Changsoo Asia-Pacific Microwave Conference (APMC) 2006, pp.1011-1014 |
0 |
원문
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