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Conference
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2024 |
Low-Carbon Epoxy-Siloxane Flux Technology for Fine-Pitch Solder Bump Interconnection
Gwang-Mun Choi International Symposium on Microelectronics and Packaging (ISMP) 2024, pp.164-164 |
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Conference
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2024 |
Heat dissipation evaluation of epoxy-boron nitride-based non-conductive films with high thermal conductivity for fine-pitch solder bump interconnection
Oh Jin Hyuk European Materials Research Society (E-MRS) Meeting 2024 (Fall), pp.1-1 |
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Conference
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2024 |
Sustainable Epoxy-Functionalized Vanillic Acid-Siloxane Nanocomposite Adhesive for Fine-Pitch Solder Bump Interconnection
Gwang-Mun Choi European Materials Research Society (E-MRS) Meeting 2024 (Fall), pp.1-1 |
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Conference
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2024 |
Laser Assisted Bonding (LAB) based Flip-chip process for fine pitch solder bumps device using Laser Non-Conductive Paste (NCP)
Jang Ki Seok Electronic System-Integration Technology Conference (ESTC) 2024, pp.1-4 |
0 |
원문
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Conference
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2023 |
Laser-Assisted Bonding with Compression (LABC) based Tiling Bonding Technology, Enabling Technology for Chiplet Integration
Choi Kwang-Seong Electronic Components and Technology Conference (ECTC) 2023, pp.1385-1389 |
4 |
원문
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Journal
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2021 |
Thermochemical Mechanism of the Epoxy-Glutamic Acid Reaction with Sn-3.0 Ag-0.5 Cu Solder Powder for Electrical Joining
Gwang-Mun Choi Polymers, v.13, no.6, pp.1-14 |
10 |
원문
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Journal
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2020 |
Epoxy-based Interconnection Materials and Process Technology Trends for Semiconductor Packaging
Eom Yong Sung 전자통신동향분석, v.35, no.4, pp.1-10 |
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원문
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Conference
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2020 |
Development of Digital Signage Modules composed of Mini-LEDs using Laser-Assisted Bonding (LAB) Technology
Choi Kwang-Seong Electronic Components and Technology Conference (ECTC) 2020, pp.1031-1036 |
9 |
원문
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Conference
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2020 |
Development of bonding process for flexible devices with fine-pitch interconnection using Anisotropic Solder Paste and Laser-Assisted Bonding Technology
Jiho Joo Electronic Components and Technology Conference (ECTC) 2020, pp.1309-1314 |
11 |
원문
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Journal
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2019 |
Origin of the Dry Etch Damage in the Short-channel Oxide Thin-film Transistors for High Resolution Display Application
Ji Hun Choi Thin Solid Films, v.674, pp.71-75 |
7 |
원문
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Journal
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2015 |
Novel Low-Volume Solder-on-Pad Process for Fine Pitch Cu Pillar Bump Interconnection
Bae Hyun-Cheol 한국마이크로전자 및 패키징학회지, v.22, no.2, pp.55-59 |
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원문
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Journal
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2014 |
Characterization and Estimation of Solder-on-Pad Process for Fine-Pitch Applications
Haksun Lee IEEE Transactions on Components, Packaging, and Manufacturing Technology, v.4, no.10, pp.1729-1738 |
15 |
원문
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Conference
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2014 |
Flip-Chip Bonding Processes with Low Volume SoP Technology
Eom Yong Sung Electronic System-Integration Technology Conference (ESTC) 2014, pp.1-4 |
0 |
원문
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Journal
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2014 |
Characterization of Fluxing and Hybrid Underfills with Micro-encapsulated Catalyst for Long Pot Life
Eom Yong Sung ETRI Journal, v.36, no.3, pp.343-351 |
35 |
원문
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Conference
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2014 |
Maskless Screen Printing Technology for 20μm-Pitch, 52InSn Solder Interconnections in Display Applications
Choi Kwang-Seong Electronic Components and Technology Conference (ECTC) 2014, pp.1154-1159 |
8 |
원문
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Journal
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2013 |
Fine‐Pitch Solder on Pad Process for Microbump Interconnection
Bae Hyun-Cheol ETRI Journal, v.35, no.6, pp.1152-1155 |
22 |
원문
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Conference
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2013 |
Thermally Activated Bumping Process using Sn3.0Ag0.5Cu Solder Powder for Low-Cost Interposers
Choi Kwang-Seong International Symposium on Microelectronics (IMAPS) 2013, pp.420-423 |
0 |
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Conference
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2013 |
Novel Low-Volume Solder-on-Pad for Fine-Pitch Cu Pillar Bump
Bae Hyun-Cheol European Microelectronics and Packaging Conference (EMPC) 2013, pp.1-4 |
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Journal
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2013 |
Optimization of Material and Process for Fine Pitch LVSoP Technology
Eom Yong Sung ETRI Journal, v.35, no.4, pp.625-631 |
21 |
원문
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Journal
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2013 |
Novel Bumping Process for Solder on Pad Technology
Choi Kwang-Seong ETRI Journal, v.35, no.2, pp.340-343 |
23 |
원문
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Conference
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2012 |
Fine-Pitch, Low-Volume SoP(Solder-on-Pad) Process
Ho-Eun Bae Electronics Packaging Technology Conference (EPTC) 2012, pp.723-727 |
2 |
원문
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Journal
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2011 |
Novel Bumping Material for Solder-on-Pad Technology
Choi Kwang-Seong ETRI Journal, v.33, no.4, pp.637-640 |
32 |
원문
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Conference
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2010 |
Novel Solder-on-Pad (SoP) Technology for Fine-Pitch Flip Chip Bonding
Choi Kwang-Seong International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP) 2010, pp.805-805 |
3 |
원문
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Conference
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2010 |
Solder Bump Maker with Coining Process on TSV Chips for 3D Packages
성기준 International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP) 2010, pp.185-189 |
4 |
원문
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Conference
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2009 |
Novel Bumping Material for Stacking Silicon Chips
Choi Kwang-Seong Electronics Packaging Technology Conference (EPTC) 2009, pp.579-583 |
2 |
원문
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Journal
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2007 |
A Flip-Chip-Packaged InP HBT Transimpedance Amplifier for 40-Gb/s Optical Link Applications
Ju Chull Won Journal of the Korean Physical Society, v.50, no.3, pp.862-865 |
2 |
원문
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Conference
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2003 |
A limiting amplifier module using wafer level package for 10Gbps optical transmission system
Ju Chull Won Electronic Components and Technology Conference (ECTC) 2003, pp.1572-1575 |
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원문
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Conference
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2002 |
The effect of via size on fine pitch and high density solder bumps for wafer level packaging
Ju Chull Won Electronic Components and Technology Conference (ECTC) 2002, pp.1178-1181 |
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원문
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