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Conference
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2024 |
Heat dissipation evaluation of epoxy-boron nitride-based non-conductive films with high thermal conductivity for fine-pitch solder bump interconnection
Oh Jin Hyuk European Materials Research Society (E-MRS) Meeting 2024 (Fall), pp.1-1 |
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Conference
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2024 |
Early Performance Evaluation of Liquid-Cooled Self-Made ARM Server
Kim Young Woo 대한전자공학회 학술 대회 (하계) 2024, pp.2591-2594 |
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Conference
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2024 |
Transfer, Bonding, and Repair of LEDs for µLED Display Fabrication via Simultaneous Transfer and Bonding (SITRAB) Technology
Shin Jungho Society for Information Display (SID) International Symposium 2024, pp.1278-1281 |
0 |
원문
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Conference
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2023 |
Analysis of Heat Dissipation Characteristics of Power Modules with Different Top Metal and Bottom Metal Thicknesses of Insulated Metal Substrate
박성효 대한전자공학회 학술 대회 (하계) 2023, pp.116-119 |
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Conference
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2022 |
Heat Dissipation Design of High-Power Wide-Bandgap Power Module with Insulated Metal Substrate
Jeong Bongmin International Conference and Exhibition on High Temperature Electronics Network (HiTEN) 2022, pp.66-70 |
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Journal
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2022 |
Switching and Heat-Dissipation Performance Analysis of an LTCC-Based Leadless Surface Mount Package
Jung Dong Yun Journal of Semiconductor Technology and Science, v.22, no.1, pp.1-9 |
1 |
원문
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Journal
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2022 |
Ti3C2Tx MXene/carbon Nanotubes/waterborne Polyurethane based Composite Ink for Electromagnetic Interference Shielding and Sheet Heater Applications
Nguyen Tam Van Chemical Engineering Journal, v.430, no.4, pp.1-11 |
79 |
원문
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Conference
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2021 |
Thermal and Electrical Reliability Analysis of TO-247 for Bonding Method, Substrate Structure and Heat Dissipation Bonding Material
Donghwan Kim Electronic Components and Technology Conference (ECTC) 2021, pp.1950-1956 |
5 |
원문
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Conference
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2020 |
Thermal analysis of power module using high heat dissipation substrate and bonding material
Donghwan Kim 대한전자공학회 학술 대회 (하계) 2020, pp.151-154 |
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Journal
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2019 |
Development of Thinned Aluminum Flat Heat Pipe Through Inclined Wall and Press Process
Moon Seok-Hwan Journal of Heat Transfer, v.141, no.9, pp.1-6 |
2 |
원문
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Conference
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2018 |
A Solution of Aluminum Flat Heat Pipe for Dry Cooling the Ladar Array
Suhyun Hong International Heat Transfer Conference (IHTC) 2018, pp.1-8 |
0 |
원문
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Conference
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2018 |
Thermal Analysis of SiC Power Semiconductor with Copper Clip Bonding and Copper Sintering Paste
Inhoo Kim International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) 2018, pp.1-4 |
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Journal
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2017 |
Hidden Innovations in the Fourth Industrial Revolution: Electronic Packaging Technology
Choi Kwang-Seong 전자통신동향분석, v.32, no.6, pp.17-26 |
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원문
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Journal
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2017 |
Power Semiconductor SMD Package Embedded in Multilayered Ceramic for Low Switching Loss
Jung Dong Yun ETRI Journal, v.39, no.6, pp.866-873 |
12 |
원문
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Journal
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2017 |
A single unit cooling fins aluminum flat heat pipe for 100 W socket type COB LED lamp
Moon Seok-Hwan Applied Thermal Engineering, v.126, pp.1164-1169 |
36 |
원문
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Conference
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2015 |
Development of a Cooling Technology for the Concentrating Solar Module with a Light Guide
Park Yoon Woo 대한설비공학회 학술 발표 대회 (하계) 2015, pp.882-885 |
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Conference
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2014 |
Nano-gap Electrode Large Area THz Emitter for the Enhanced Emission Efficiency and Heat Dissipation
Moon Kiwon International Conference on Infrared, Millimeter, and Terahertz waves (IRMMW-THz) 2014, pp.1-2 |
6 |
원문
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Conference
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2014 |
Development of a Heat Pipe Heat Dissipation Method for CPV Application
Moon Seok-Hwan International Conference on Concentrator Photovoltaic Systems (CPV) 2014, pp.140-143 |
4 |
원문
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Journal
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2013 |
Low-Temperature-Grown InGaAs Terahertz Photomixer Embedded in InP Thermal Spreading Layer Regrown by Metalorganic Chemical Vapor Deposition
Moon Kiwon Optics Letters, v.38, no.24, pp.5466-5469 |
11 |
원문
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Journal
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2013 |
Temperature and Injection Current Dependent Optical and Thermal Characteristics of InGaN-Based Green Large-Area Light-Emitting Diodes
이수현 Physica Status Solidi (A), v.210, no.11, pp.2479-2484 |
5 |
원문
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Journal
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2012 |
Single package directly modulated laser bidirectional optical subassembly using a modified mini-dual-in-line package for 10 Gbps passive optical networks
Jong Jin Lee Optical Engineering, v.51, no.12, pp.1-3 |
2 |
원문
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Conference
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2008 |
Numerical Modeling and Measurements on the Shielding Effectiveness of Enclosure with Apertures
Kwon Jong Hwa Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC) / International Zurich Symposium on Electromagnetic Compatibility 2008, pp.887-890 |
6 |
원문
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Journal
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2005 |
Thermal Characteristics of a Laser Diode Integrated on a Silica-Terraced PLC Platform
Kim Duk Jun ETRI Journal, v.27, no.3, pp.337-340 |
7 |
원문
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Journal
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2001 |
Experimental study on the performance of miniature heat pipes with woven-wire wick
Moon Seok-Hwan IEEE Transactions on Components and Packaging Technologies, v.24, no.4, pp.591-595 |
16 |
원문
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