Conference
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2024 |
GaAs mHEMT Technology Achieving a High Cut-off Frequncy of 446 GHz with a Gate Length of 75 nm
Park Jongyul International Conference on Information and Communication Technology Convergence (ICTC) 2024, pp.1468-1469 |
0 |
원문
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Conference
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2024 |
Impact of Gate Length Scaling on DC and RF Performance in AlGaN/GaN HEMTs
Jung Hyunwook International Conference on Information and Communication Technology Convergence (ICTC) 2024, pp.1443-1444 |
0 |
원문
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Journal
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2023 |
Analysis of issues in gate recess etching in the InAlAs/InGaAs HEMT manufacturing process
Min Byoung-Gue ETRI Journal, v.45, no.1, pp.171-179 |
4 |
원문
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Journal
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2017 |
Characterization of 0.18-μm Gate Length AlGaN/GaN HEMTs on SiC Fabricated Using Two-Step Gate Recessing
Hyung Sup Yoon Journal of the Korean Physical Society, v.71, no.6, pp.360-364 |
2 |
원문
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Journal
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2017 |
Characteristics of Enhanced-Mode AlGaN/GaN MIS HEMTs for Millimeter Wave Applications
Jongmin Lee Journal of the Korean Physical Society, v.71, no.6, pp.365-369 |
7 |
원문
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Journal
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2016 |
Microwave Low-Noise Performance of 0.17 μm Gate-Length AlGaN/GaN HEMTs on SiC With Wide Head Double-Deck T-Shaped Gate
Hyung Sup Yoon IEEE Electron Device Letters, v.37, no.11, pp.1407-1410 |
28 |
원문
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Journal
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2016 |
Effect of Fluoride-based Plasma Treatment on the Performance of AlGaN/GaN MISFET
Hokyun Ahn ETRI Journal, v.38, no.4, pp.675-684 |
5 |
원문
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Conference
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2016 |
GaN HEMT Modeling for X-band Applications
Kim Seong-Il 대한전자공학회 종합 학술 대회 (하계) 2016, pp.2557-2560 |
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Conference
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2016 |
Temperature Dependence of Current-voltage Characteristics of Packaged AlGaN/GaN HEMT on SiC Substrate
Jongmin Lee 한국 반도체 학술 대회 (KCS) 2016, pp.1-2 |
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Journal
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2015 |
Characteristics of a Field Plate Connected to T-shaped Gate in AlGaN/GaN HEMTs
Kyu Jun Cho Journal of the Korean Physical Society, v.67, no.4, pp.682-686 |
3 |
원문
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Conference
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2015 |
X-Band Power Amplifier Using 40W GaN-on-SiC HEMT
Dong Min Kang 대한전자공학회 종합 학술 대회 (하계) 2015, pp.231-234 |
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Conference
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2015 |
Variations of DC Properties of AlGaN/GaN HEMT by Process Enhancement of Gate Recess
Min Byoung-Gue 대한전자공학회 종합 학술 대회 (하계) 2015, pp.192-195 |
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Journal
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2015 |
X‐band 100 W solid‐state power amplifier using a 0.25 μM GaN HEMT technology
Dong Min Kang Microwave and Optical Technology Letters, v.57, no.1, pp.212-216 |
6 |
원문
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Conference
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2014 |
100W Pulsed SSPA Using 25W AlGaN/GaN HEMT Technology at 9.2 - 9.5 GHz
Dong Min Kang International Symposium on the Physics of Semiconductors and Applications (ISPSA) 2014, pp.75-75 |
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Conference
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2014 |
Characteristics of AlGaN/GaN HEMTs on SiC with Pt-based Schottky Contacts
Hyung Sup Yoon 한국 반도체 학술 대회 (KCS) 2014, pp.1-1 |
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Journal
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2011 |
Pre-Silicidation Annealing Effect on Platinum-Silicided Schottky Barrier MOSFETs
Jun Myungsim Semiconductor Science and Technology, v.26, no.12, pp.1-4 |
0 |
원문
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Conference
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2011 |
Design of 220 GHz-band Amplifier Using InP HEMT Technology
Woojin Chang International Technical Conference on Circuits/Systems, Computers and Communications (ITC-CSCC) 2011, pp.1120-1122 |
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Journal
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2011 |
High Performance Platinum-Silicided P-Type Schottky Barrier Metal-Oxide-Semiconductor Field-Effect Transistors Scaled Down to 30 nm
Jun Myungsim Journal of Vacuum Science and Technology B, v.29, no.3, pp.1-4 |
1 |
원문
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Conference
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2010 |
Device Characteristics of AlGaN/GaN HEMT for S/X-band Applications
Woojin Chang 대한전자공학회 종합 학술 대회 (하계) 2010, pp.1984-1987 |
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Journal
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2008 |
A Two-step Annealing Process for Ni Silicide Formation in an Ultra-thin Body RF SOI MOSFET
Chang-Geun Ahn Materials Science and Engineering B, v.147, no.2-3, pp.183-186 |
4 |
원문
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Journal
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2007 |
Gate Recess Process for 80-nm T-Shaped Gate Metamorphic HEMTs on GaAs Substrates
Hyung Sup Yoon Journal of the Korean Physical Society, v.50, no.3, pp.889-892 |
4 |
원문
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Conference
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2006 |
Numerical Analysis and IR Scan Test for Thermal Resistance of GaAs MMIC in a Communications Satellite
Kwak Changsoo Asia-Pacific Microwave Conference (APMC) 2006, pp.1011-1014 |
0 |
원문
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Journal
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2005 |
30-nm recessed S/D SOI MOSFET with an ultrathin body and a low SDE resistance
Chang-Geun Ahn IEEE Electron Device Letters, v.26, no.7, pp.486-488 |
16 |
원문
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Conference
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2005 |
EBL Patterning of Sub-10 nm Line Using HSQ with Plasma Etching Process and Fabricating of Triple-Gate MOS Transistors with 6 nm Gate Length
Baek In Bok Silicon Nanoelectronics Workshop (SNW) 2005, pp.16-17 |
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Conference
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2005 |
A CMOS Burst-Mode Up-Stream Transmitter For Fiber-Optic Gigabit Ethernet Applications
오영훈 International Conference on Advanced Communication Technology (ICACT) 2005, pp.1283-1286 |
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원문
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Conference
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2004 |
Recessed source-drain (S/D) SOI MOSFETs with low S/D extension (SDE) external resistance
Chang Geun Ahn International SOI Conference 2004, pp.207-208 |
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원문
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Journal
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2004 |
Fabrication of 50-nm gate SOI n-MOSFETs using novel plasma-doping technique
Cho Wonju IEEE Electron Device Letters, v.25, no.6, pp.366-368 |
35 |
원문
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Journal
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2004 |
The effects of isoelectronic Al doping and process optimization for the fabrication of high-power AlGaN-GaN HEMTs
Youn Doo Hyeb IEEE Transactions on Electron Devices, v.51, no.5, pp.785-789 |
15 |
원문
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Journal
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2002 |
High Transconductance Modulation-doped SiGe pMOSFETs by RPCVD
Young Joo Song Electronics Letters, v.38, no.23, pp.1479-1480 |
3 |
원문
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Conference
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2002 |
The Effects of Plasma Induced Damage on The Channel Layers of Ion Implanted GaAs MESFETs during Reactive Ion Etching(RIE) and Plasma Ashing Processes
Hokyun Ahn Materials Research Society (MRS) Meeting 2002 (Spring), v.720, pp.67-72 |
1 |
원문
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Journal
|
2001 |
A new technique to extract channel mobility in submicron MOSFETs using inversion charge slope obtained from measured S-parameters
Seonghearn Lee IEEE Transactions on Electron Devices, v.48, no.4, pp.784-788 |
12 |
원문
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