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Conference
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2024 |
Laser Assisted Bonding (LAB) technology using Laser Non-Conductive Paste (NCP) for Micro solder bumps
Jang Ki Seok International Symposium on Microelectronics and Packaging (ISMP) 2024, pp.272-272 |
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Conference
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2024 |
Low-Carbon Epoxy-Siloxane Flux Technology for Fine-Pitch Solder Bump Interconnection
Gwang-Mun Choi International Symposium on Microelectronics and Packaging (ISMP) 2024, pp.164-164 |
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Conference
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2024 |
Heat dissipation evaluation of epoxy-boron nitride-based non-conductive films with high thermal conductivity for fine-pitch solder bump interconnection
Oh Jin Hyuk European Materials Research Society (E-MRS) Meeting 2024 (Fall), pp.1-1 |
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Conference
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2024 |
Sustainable Epoxy-Functionalized Vanillic Acid-Siloxane Nanocomposite Adhesive for Fine-Pitch Solder Bump Interconnection
Gwang-Mun Choi European Materials Research Society (E-MRS) Meeting 2024 (Fall), pp.1-1 |
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Conference
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2024 |
Laser Assisted Bonding (LAB) based Flip-chip process for fine pitch solder bumps device using Laser Non-Conductive Paste (NCP)
Jang Ki Seok Electronic System-Integration Technology Conference (ESTC) 2024, pp.1-4 |
0 |
원문
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Conference
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2023 |
Process Window of Mini-LED Display Panel Packaging using Laser Assisted Bonding Technology
Eom Yong Sung European Microelectronics and Packaging Conference (EMPC) 2023, pp.1-4 |
0 |
원문
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Conference
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2017 |
Development of Stacking Process for 3D TSV (Through Silicon Via) Structure using Laser
Choi Kwang-Seong International Microelectronics Assembly and Packaging Society (IMAPS) 2017, pp.1-5 |
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원문
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Journal
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2016 |
Sn58Bi Solder Interconnection for Low-Temperature Flex-on-Flex Bonding
Haksun Lee ETRI Journal, v.38, no.6, pp.1163-1171 |
14 |
원문
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Conference
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2016 |
Thermal and Electrical Designs of RF 3D Module Based on Si Interposers with Redundant TSVs
Choi Kwang-Seong Electronic Components and Technology Conference (ECTC) 2016, pp.2051-2057 |
2 |
원문
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Journal
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2016 |
Characterization of Transmission Lines with Through-silicon-vias and Bump Joints on High-resistivity Si Interposers for RF Three-dimensional Modules
Choi Kwang-Seong Japanese Journal of Applied Physics, v.55, no.6S3, pp.1-5 |
2 |
원문
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Conference
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2015 |
Maskless Screen Printing Technology using Solder Bump Maker (SBM) for Flexible Electronics
Choi Kwang-Seong International Conference on Electronics Packaging & iMAPS All Asia Conference (ICEP & IAAC) 2015, pp.276-291 |
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Journal
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2015 |
Interconnection Technology Based on InSn Solder for Flexible Display Applications
Choi Kwang-Seong ETRI Journal, v.37, no.2, pp.387-394 |
13 |
원문
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Journal
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2014 |
Characterization and Estimation of Solder-on-Pad Process for Fine-Pitch Applications
Haksun Lee IEEE Transactions on Components, Packaging, and Manufacturing Technology, v.4, no.10, pp.1729-1738 |
15 |
원문
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Conference
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2014 |
Flip-Chip Bonding Processes with Low Volume SoP Technology
Eom Yong Sung Electronic System-Integration Technology Conference (ESTC) 2014, pp.1-4 |
0 |
원문
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Conference
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2014 |
Maskless Screen Printing Technology for 20μm-Pitch, 52InSn Solder Interconnections in Display Applications
Choi Kwang-Seong Electronic Components and Technology Conference (ECTC) 2014, pp.1154-1159 |
8 |
원문
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Journal
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2013 |
Fine‐Pitch Solder on Pad Process for Microbump Interconnection
Bae Hyun-Cheol ETRI Journal, v.35, no.6, pp.1152-1155 |
22 |
원문
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Conference
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2013 |
Thermally Activated Bumping Process using Sn3.0Ag0.5Cu Solder Powder for Low-Cost Interposers
Choi Kwang-Seong International Symposium on Microelectronics (IMAPS) 2013, pp.420-423 |
0 |
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Conference
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2013 |
Novel Interconnection Technology for Flex-on-Glass (FOG) Applications
Haksun Lee European Microelectronics and Packaging Conference (EMPC) 2013, pp.1-5 |
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Journal
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2013 |
Optimization of Material and Process for Fine Pitch LVSoP Technology
Eom Yong Sung ETRI Journal, v.35, no.4, pp.625-631 |
21 |
원문
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Journal
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2013 |
Novel Bumping Process for Solder on Pad Technology
Choi Kwang-Seong ETRI Journal, v.35, no.2, pp.340-343 |
23 |
원문
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Conference
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2012 |
Fine-Pitch, Low-Volume SoP(Solder-on-Pad) Process
Ho-Eun Bae Electronics Packaging Technology Conference (EPTC) 2012, pp.723-727 |
2 |
원문
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Journal
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2012 |
Novel Bumping and Underfill Technologies for 3D IC integration
성기준 ETRI Journal, v.34, no.5, pp.706-712 |
30 |
원문
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Conference
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2012 |
Novel Low-Volume Solder-on-Pad (SoP) Material and Process for Flip Chip Bonding Using Au Stud Bumps
Choi Kwang-Seong Electronic Components and Technology Conference (ECTC) 2012, pp.1919-1924 |
1 |
원문
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Conference
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2011 |
SoP(Solder on Pad) Technology with SBM(Solder Bump Maker) Material
Noh Jung Hyun 한국마이크로전자 및 패키징학회 학술 대회 (추계) 2011, pp.1-1 |
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Journal
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2011 |
Novel Bumping Material for Solder-on-Pad Technology
Choi Kwang-Seong ETRI Journal, v.33, no.4, pp.637-640 |
32 |
원문
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Conference
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2011 |
Bumping and Stacking Processes for 3D IC using Fluxfree Polymer
Choi Kwang-Seong Electronic Components and Technology Conference (ECTC) 2011, pp.1746-1751 |
3 |
원문
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Conference
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2010 |
Novel Solder-on-Pad (SoP) Technology for Fine-Pitch Flip Chip Bonding
Choi Kwang-Seong International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP) 2010, pp.805-805 |
3 |
원문
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Conference
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2010 |
Solder Bump Maker with Coining Process on TSV Chips for 3D Packages
성기준 International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP) 2010, pp.185-189 |
4 |
원문
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Conference
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2010 |
3D SiP Module using TSV and Novel Solder Bump Maker
Bae Hyun-Cheol Electronic Components and Technology Conference (ECTC) 2010, pp.1637-1641 |
5 |
원문
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Conference
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2010 |
Optimized TSV Process using Bottom-up Electroplating without Wafer Cracks
임병옥 Electronic Components and Technology Conference (ECTC) 2010, pp.1642-1646 |
6 |
원문
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Journal
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2010 |
Novel Maskless Bumping for 3D Integration
Choi Kwang-Seong ETRI Journal, v.32, no.2, pp.342-344 |
37 |
원문
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Conference
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2002 |
The effect of via size on fine pitch and high density solder bumps for wafer level packaging
Ju Chull Won Electronic Components and Technology Conference (ECTC) 2002, pp.1178-1181 |
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원문
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