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Conference
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2024 |
Laser Assisted Bonding (LAB) based Flip-chip process for fine pitch solder bumps device using Laser Non-Conductive Paste (NCP)
Jang Ki Seok Electronic System-Integration Technology Conference (ESTC) 2024, pp.1-4 |
0 |
원문
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Conference
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2024 |
A Comparative Study of Au Stud and Cu Pillar in Flip-Chip bonding for 2.5D/3D Integrated Terabit Optical Chiplet
Lee Jyung Chan Optics and Photonics Congress 2024, pp.1-1 |
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Conference
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2023 |
Design and Verification Methodologies of D-Band Antenna Modules for Security Imaging Applications
Lee Jaeyeong International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting 2023, pp.329-330 |
2 |
원문
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Journal
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2022 |
53 GBd PAM-4 fully-integrated silicon photonics transmitter with a hybrid flip-chip bonded laser
Sanghwa Yoo Optics Express, v.30, no.23, pp.41980-41998 |
6 |
원문
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Conference
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2022 |
Epoxy based Solder Paste for Flexible Substrate with Laser Assisted Bonding Process
Jang Ki Seok Electronic System-Integration Technology Conference (ESTC) 2022, pp.28-30 |
2 |
원문
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Conference
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2022 |
Laser-Assisted Bonding (LAB) Process and its Bonding Materials as Technologies enabling the Low-Carbon Era
Choi Kwang-Seong Electronic Components and Technology Conference (ECTC) 2022, pp.196-203 |
5 |
원문
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Journal
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2018 |
Laser-Assisted Bonding Technology for Interconnections of Multidimensional Heterogeneous Devices
Choi Kwang-Seong 전자통신동향분석, v.33, no.6, pp.50-57 |
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원문
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Journal
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2018 |
Crosslinkable deoxidizing hybrid adhesive of epoxy–diacid for electrical interconnections in semiconductor packaging
Keonsoo Jang Polymer International, v.67, no.9, pp.1241-1247 |
21 |
원문
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Journal
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2017 |
Cost-effective Parallel Optical Interconnection Module Based on Fully Passive-alignment Process
Son Dong Hoon Optical Engineering, v.56, no.11, pp.1-4 |
3 |
원문
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Conference
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2016 |
Device Characterization of the VCSEL-on-silicon as an on Chip Light Source
Kwack Myungjoon Silicon Photonics XI (SPIE 9752), v.9752, pp.1-6 |
1 |
원문
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Journal
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2015 |
Interconnection Technology Based on InSn Solder for Flexible Display Applications
Choi Kwang-Seong ETRI Journal, v.37, no.2, pp.387-394 |
13 |
원문
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Conference
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2014 |
Development of Low Contact Resistance Interconnection for Display Applications
Haksun Lee Electronic System-Integration Technology Conference (ESTC) 2014, pp.1-5 |
4 |
원문
|
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Conference
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2014 |
Flip-Chip Bonding Processes with Low Volume SoP Technology
Eom Yong Sung Electronic System-Integration Technology Conference (ESTC) 2014, pp.1-4 |
0 |
원문
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Journal
|
2014 |
Characterization of Fluxing and Hybrid Underfills with Micro-encapsulated Catalyst for Long Pot Life
Eom Yong Sung ETRI Journal, v.36, no.3, pp.343-351 |
35 |
원문
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Journal
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2013 |
Fine‐Pitch Solder on Pad Process for Microbump Interconnection
Bae Hyun-Cheol ETRI Journal, v.35, no.6, pp.1152-1155 |
22 |
원문
|
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Conference
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2013 |
Thermally Activated Bumping Process using Sn3.0Ag0.5Cu Solder Powder for Low-Cost Interposers
Choi Kwang-Seong International Symposium on Microelectronics (IMAPS) 2013, pp.420-423 |
0 |
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Journal
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2013 |
Novel Bumping Process for Solder on Pad Technology
Choi Kwang-Seong ETRI Journal, v.35, no.2, pp.340-343 |
23 |
원문
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Conference
|
2012 |
Fine-Pitch, Low-Volume SoP(Solder-on-Pad) Process
Ho-Eun Bae Electronics Packaging Technology Conference (EPTC) 2012, pp.723-727 |
2 |
원문
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Conference
|
2012 |
Hybrid-Integrated Coherent Receiver Using Silica-Based PLC Technology
Jong-Hoi Kim Opto-Electronics and Communications Conference (OECC) 2012, pp.216-217 |
1 |
원문
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Conference
|
2012 |
Novel Low-Volume Solder-on-Pad (SoP) Material and Process for Flip Chip Bonding Using Au Stud Bumps
Choi Kwang-Seong Electronic Components and Technology Conference (ECTC) 2012, pp.1919-1924 |
1 |
원문
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Conference
|
2011 |
Hybrid-integrated Coherent Receiver using Silica-based Planar Lightwave Circuit Technology
Kwon Yong-Hwan Asia Communications and Photonics Conference (ACP) 2011, pp.1-6 |
0 |
원문
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Conference
|
2010 |
Novel Solder-on-Pad (SoP) Technology for Fine-Pitch Flip Chip Bonding
Choi Kwang-Seong International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP) 2010, pp.805-805 |
3 |
원문
|
|
Conference
|
2010 |
Optimized TSV Process using Bottom-up Electroplating without Wafer Cracks
임병옥 Electronic Components and Technology Conference (ECTC) 2010, pp.1642-1646 |
6 |
원문
|
|
Journal
|
2008 |
Electrical and Mechanical Characterization of an Anisotropic Conductive Adhesive with a Low Melting Point Solder
Eom Yong Sung Microelectronic Engineering, v.85, no.11, pp.2202-2206 |
32 |
원문
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|
Journal
|
2007 |
A Flip-Chip-Packaged InP HBT Transimpedance Amplifier for 40-Gb/s Optical Link Applications
Ju Chull Won Journal of the Korean Physical Society, v.50, no.3, pp.862-865 |
2 |
원문
|
|
Conference
|
2007 |
Replication technology as a means of implementing polymer MOEMS
Jin Tae Kim Micromachining Technology for Micro-Optics and Nano-Optics V and Microfabrication Process Technology XII (SPIE 6462), v.6462, pp.1-7 |
0 |
원문
|
|
Conference
|
2006 |
A Flip Chip Packaged InP HBT Transimpedance Amplifier for 40 Gb/s Optical Link Application
Ju Chull Won International Symposium on the Physics of Semiconductors and Applications (ISPSA) 2006, pp.1-1 |
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|
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Journal
|
2006 |
Multichip Optical Transmitter Module for Chip-to-chip Interconnection on Optical PCBs
Kang Sae-Kyoung Electronics Letters, v.42, no.14, pp.805-806 |
9 |
원문
|
|
Conference
|
2006 |
Thermal Analysis and Performance in 1.55um Bottom-Emitting InAlGaAs VCSELs with Dielectric Mirror, Flip-Chip Bonded on Si-Substrate
Kim Jong Deog International Conference on Optical Internet and Next Generation Network (COIN-NGNCON) 2006, pp.355-357 |
0 |
원문
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Journal
|
2005 |
Thermal Characteristics of a Laser Diode Integrated on a Silica-Terraced PLC Platform
Kim Duk Jun ETRI Journal, v.27, no.3, pp.337-340 |
7 |
원문
|
|
Journal
|
2004 |
A Two-Step Etching Technique for Silica Terraces in the PLC Hybrid Integration
Han Young-Tak Photonics Technology Letters, v.16, no.11, pp.2436-2438 |
12 |
원문
|
|
Journal
|
2004 |
Passive alignment method of polymer PLC devices by using a hot embossing technique
Jin Tae Kim IEEE Photonics Technology Letters, v.16, no.7, pp.1664-1666 |
39 |
원문
|
|
Conference
|
2003 |
Packaging technology for wavelength tunable filter based on optical MEMS
Eom Yong Sung IEEE LEOS International Conference on Optical MEMS 2003, pp.67-68 |
0 |
원문
|
|
Conference
|
2002 |
The effect of via size on fine pitch and high density solder bumps for wafer level packaging
Ju Chull Won Electronic Components and Technology Conference (ECTC) 2002, pp.1178-1181 |
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원문
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