Conference
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2024 |
Laser Assisted Bonding (LAB) based Flip-chip process for fine pitch solder bumps device using Laser Non-Conductive Paste (NCP)
Jang Ki Seok Electronic System-Integration Technology Conference (ESTC) 2024, pp.1-4 |
0 |
원문
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Journal
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2024 |
Development Trends in Advanced Packaging Technology of Global Foundry Big Three
Hwangsoo Chun 전자통신동향분석, v.39, no.4, pp.98-106 |
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원문
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Journal
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2024 |
Tuning the Threshold Voltage of an Oxide Thin-Film Transistor by Electron Injection Control Using a p−n Semiconductor Heterojunction Structure
Jung Hoon Han ACS Applied Materials & Interfaces, v.16, no.24, pp.31254-31260 |
0 |
원문
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Journal
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2021 |
Synaptic Transistors Exhibiting Gate-Pulse-Driven, Metal-Semiconductor Transition of Conduction
Lim Jungwook Materials, v.14, no.24, pp.1-8 |
4 |
원문
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Conference
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2021 |
Recent Progress of GaN-based Semiconductor Device Technologies in ETR
Hyung Seok Lee Europe-Korea Conference on Science and Technology (EKC) 2021, pp.1-1 |
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Journal
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2021 |
Issues on Monolithic 3D Integration Techniques for Realizing Next Generation Intelligent Devices
Jaehyun Moon 전자통신동향분석, v.36, no.3, pp.12-22 |
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원문
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Journal
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2021 |
Mott-Insulator Metal Switching Technology for New Concept Devices
Hyun-Tak Kim 전자통신동향분석, v.36, no.3, pp.34-40 |
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원문
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Journal
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2020 |
Work Function Tuning of Zinc-Tin Oxide Thin Films Using High-Density O2 Plasma Treatment
주영희 Coatings, v.10, no.11, pp.1-9 |
19 |
원문
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Journal
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2020 |
Epoxy-based Interconnection Materials and Process Technology Trends for Semiconductor Packaging
Eom Yong Sung 전자통신동향분석, v.35, no.4, pp.1-10 |
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원문
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Conference
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2019 |
다이아몬드기반 반도체 연구개발 동향
Hyung Seok Lee 한국물리학회 학술 논문 발표회 (봄) 2019, pp.1-1 |
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Journal
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2018 |
Technical Trends of Semiconductors for Harsh Environments
Woojin Chang 전자통신동향분석, v.33, no.6, pp.12-23 |
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원문
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Journal
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2017 |
Reconfigurable Yagi-Uda Antenna based on a Silicon Reflector with a Solid-State Plasma
박장순 Scientific Reports, v.7, pp.1-8 |
11 |
원문
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Journal
|
2017 |
Reconfigurable Yagi-Uda Antenna based on a Silicon Reflector with a Solid-State Plasma
Kim Cheol Ho Scientific Reports, v.7, pp.1-8 |
11 |
원문
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Journal
|
2017 |
Reconfigurable Yagi-Uda Antenna based on a Silicon Reflector with a Solid-State Plasma
김다진 Scientific Reports, v.7, pp.1-8 |
11 |
원문
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Journal
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2017 |
Impact of Transient Currents Caused by Alternating Drain Stress in Oxide Semiconductors
이현준 Scientific Reports, v.7, pp.1-9 |
22 |
원문
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Journal
|
2017 |
Impact of Transient Currents Caused by Alternating Drain Stress in Oxide Semiconductors
Cho Sung Haeng Scientific Reports, v.7, pp.1-9 |
22 |
원문
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Conference
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2015 |
Effects on Breakdown Voltage Characteristics of Various Field Plates in GaN FETs
Woojin Chang International Conference on Nitride Semiconductors (ICNS) 2015, pp.1-2 |
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Conference
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2014 |
Photonics Solution for Single Chip Terahertz Transceiver
Park Kyung Hyun International Conference on Optical Internet (COIN) 2014, pp.1-2 |
0 |
원문
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Conference
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2011 |
PN Junction Formation in CuInxGa(1_x)Se2-based Thin Film Solar Cell
박순미 International Symposium on Atomic Level Characterizations for New Materials and Devices (ALC) 2011, pp.1-2 |
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Journal
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2010 |
Effective Metal Work Function of Pt Gate Electrode in Ge Metal Oxide Semiconductor Device
S. V. Jagadeesh Chandra Journal of the Electrochemical Society, v.157, no.5, pp.H546-H550 |
14 |
원문
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Conference
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2009 |
Organic Schottky Diode for Flexible Organic RFID
Kim Kang Dae International Conference on Flexible and Printed Electronics (ICFPE) 2009, pp.11-13 |
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Journal
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2007 |
40 Gbps All-Optical 3R Regeneration and Format Conversion with Related InP-Based Semiconductor Devices
전민용 ETRI Journal, v.29, no.5, pp.633-640 |
12 |
원문
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Journal
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2007 |
Observation of abrupt first-order metal–insulator transition in Be-doped GaAs
Hyun-Tak Kim Journal of Crystal Growth, v.301-302, pp.252-255 |
4 |
원문
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